ʻO ka Hoʻohālikelike Copper Foil Paʻa loa

2.RA, Rolled annealed copper foil, ua hana ia ma ka hana ana i ke keleawe oka i loko o ke keleawe ingots, a laila pickling a degreasing, a me ka wela mau olokaa a me ka calendering ma ka wela wela ma luna o 800 ° C.

3.HTE, kiʻekiʻe wela elongation electro waiho copper foil, he keleawe foil e malama maikai elongation ma kiʻekiʻe wela (180 ℃). I waena o lākou, pono e mālama ʻia ka elongation o 35μm a me 70μm mānoanoa keleawe keleawe ma ke kiʻekiʻe wela (180 ℃) ma mua o 30% o ka elongation ma ke ana wela. Kapa ʻia ʻo ia ʻo HD copper foil (high ductility copper foil).

4.RTF, Reverse treated copper foil, also called reverse copper foil, hoʻomaikaʻi i ka hoʻopili ʻana a hoʻemi i ka ʻinoʻino ma o ka hoʻohui ʻana i kahi uhi resin kikoʻī ma luna o ka ʻili aniani o ka electrolytic copper foil. ʻO ka roughness maʻamau ma waena o 2-4um. ʻO ka ʻaoʻao o ka ʻili keleawe i hoʻopaʻa ʻia i ka papa resin he haʻahaʻa haʻahaʻa loa, ʻoiai ʻo ka ʻaoʻao ʻoʻoleʻa o ka ʻili keleawe e kū i waho. ʻO ka haʻahaʻa haʻahaʻa keleawe foil roughness o ka laminate he mea kōkua nui no ka hana ʻana i nā hiʻohiʻona kaapuni maikaʻi ma ka ʻaoʻao o loko, a ʻo ka ʻaoʻao ʻala e hōʻoia i ka pili. Ke hoʻohana ʻia ka ʻili haʻahaʻa haʻahaʻa no nā hōʻailona alapine kiʻekiʻe, hoʻomaikaʻi nui ʻia ka hana uila.

5.DST, luaʻaoʻao lapaʻau keleawe foil, roughening a me ka laumania surfaces. ʻO ke kumu nui e hōʻemi i nā kumukūʻai a mālama i ka mālama ʻana i ke keleawe keleawe a me nā ʻanuʻu browning ma mua o ka lamination. ʻO ka pōʻino, ʻaʻole hiki ke ʻoki ʻia ka ʻili keleawe, a paʻakikī ke wehe ʻana i ka lepo i ka wā i haumia ai. Ke emi mālie nei ka palapala noi.

6.LP, haʻahaʻa haʻahaʻa keleawe foil. ʻO nā pahu keleawe ʻē aʻe me nā ʻaoʻao haʻahaʻa, ʻo ia ka VLP copper foil (Very low profile copper foil), HVLP copper foil (High Volume Low Pressure), HVLP2, etc. ʻaʻohe kolamu kolamu, a he mau kristal lamellar me nā ʻaoʻao pālahalaha, kahi kūpono i ka hoʻouna ʻana i ka hōʻailona.

7.RCC, resin coated copper foil, i ikeia hoi he resin copper foil, adhesive-backed copper foil. He pepa keleawe electrolytic lahilahi ia (ʻo ka mānoanoa ≦18μm) me hoʻokahi a ʻelua mau ʻāpana o ke kolu resin i haku ʻia (ʻo ka mea nui o ka resin ka mea maʻamau epoxy resin) i uhi ʻia ma ka ʻili o ka ʻili, a wehe ʻia ka mea hoʻoheheʻe ʻia e ka maloʻo. he umu, a lilo ka resin i ka pae B semi-cured.

8.UTF, ultra thin copper foil, e pili ana i ke keleawe foil me ka mānoanoa o lalo o 12μm. ʻO ka mea maʻamau ka pahu keleawe ma lalo o 9μm, i hoʻohana ʻia i ka hana ʻana i nā papa kaapuni i paʻi ʻia me nā kaapuni maikaʻi a kākoʻo mau ʻia e kahi mea lawe.
Kiʻekiʻe kiʻekiʻe keleawe foil eʻoluʻolu e leka uilainfo@cnzhj.com