ʻO ka ʻokoʻa ma waena o ka pahu keleawe ʻōwili (RA copper foil) a me electrolytic copper foil (ED copper foil)

Pepa keleaweHe mea pono ia i ka hana ʻana o ka papa kaapuni no ka mea he nui nā hana e like me ka pilina, conductivity, dissipation wela, a me ka pale electromagnetic. ʻIke ʻia kona koʻikoʻi. I kēia lā wau e wehewehe aku iā ʻoe e pili anapepa keleawe i ʻōwili ʻia(RA) a me ka ʻokoʻa ma waenaelectrolytic copper foil(ED) a me ka hoʻokaʻawale ʻana o ka PCB copper foil.

 

PCB keleawe pepahe mea conductive i hoʻohana ʻia e hoʻohui i nā ʻāpana uila ma nā papa kaapuni. E like me ke kaʻina hana a me ka hana ʻana, hiki ke hoʻokaʻawale ʻia ka pahu keleawe PCB i ʻelua mau ʻāpana: ʻōwili ʻia i ke keleawe keleawe (RA) a me ka foil keleawe electrolytic (ED).

Hana ʻia ka pahu keleawe i ʻōwili ʻia me nā blank keleawe maʻemaʻe ma o ka ʻōwili mau ʻana a me ke kaomi ʻana. He ʻili maʻemaʻe kona, haʻahaʻa haʻahaʻa a me ka conductivity uila maikaʻi, a kūpono no ka hoʻouna ʻana i nā hōʻailona kiʻekiʻe. Eia nō naʻe, ʻoi aku ka kiʻekiʻe o ke kumukūʻai o ka pahu keleawe i ʻōwili ʻia a ua kaupalena ʻia ka mānoanoa, ma waena o 9-105 µm.

 

Loaʻa ʻia ka foil keleawe electrolytic e ka hoʻoheheʻe electrolytic deposition ma kahi pā keleawe. He laulima kekahi ʻaoʻao a ʻoʻoleʻa kekahi ʻaoʻao. Hoʻopili ʻia ka ʻaoʻao ʻōpala i ka substrate, ʻoiai hoʻohana ʻia ka ʻaoʻao maʻemaʻe no ka electroplating a i ʻole etching. ʻO nā mea maikaʻi o ka electrolytic copper foil ʻo ia ke kumu kūʻai haʻahaʻa a me ka laulā o nā mānoanoa, maʻamau ma waena o 5-400 µm. Eia nō naʻe, he kiʻekiʻe kona ʻāʻī ʻili a ʻilihune kona conductivity uila, no laila ʻaʻole kūpono ia no ka hoʻouna ʻana i nā hōʻailona kiʻekiʻe.

Hoʻokaʻawale ʻana i ka PCB keleawe foil

 

Eia kekahi, e like me ka roughness o electrolytic copper foil, hiki ke hoʻokaʻawale ʻia i nā ʻano aʻe:

 

HTE(High Temperature Elongation): High-elongation elongation copper foil, i hoʻohana nui ʻia i nā papa kaapuni multi-layer, he ductility kiʻekiʻe kiʻekiʻe a me ka ikaika paʻa, a ʻo ka roughness ma waena o 4-8 µm.

 

RTF(Reverse Treat Foil): Hoʻihoʻi i ka mālama ʻana i ke keleawe keleawe, ma ka hoʻohui ʻana i kahi uhi resin kikoʻī ma ka ʻaoʻao maʻemaʻe o ka pahu keleawe electrolytic e hoʻomaikaʻi ai i ka hana adhesive a hoʻemi i ka ʻino. ʻO ka maʻamau ma waena o 2-4 µm.

 

ULP(Ultra Low Profile): Ultra-low profile copper foil, hana ʻia me ka hoʻohana ʻana i ke kaʻina hana electrolytic kūikawā, he haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa a kūpono no ka hoʻouna ʻana i nā hōʻailona kiʻekiʻe. ʻO ka maʻamau ma waena o 1-2 µm.

 

HVLP(High Velocity Low Profile): High-speed low-profile copper foil. Ma muli o ka ULP, ua hana ʻia e ka hoʻonui ʻana i ka wikiwiki electrolysis. He haʻahaʻa haʻahaʻa roughness ili a me ka hana kiʻekiʻe. ʻO ka maʻamau ma waena o 0.5-1 µm. .