ʻO ka noi opepa keleawei nā papa alakaʻi i hōʻike nui ʻia ma nā ʻano aʻe:
●Koho mea:
Hana ʻia nā papa alakaʻi i nā ʻāpana keleawe a i ʻole nā mea keleawe no ka mea he kiʻekiʻe ka conductivity uila a me ka conductivity thermal kiʻekiʻe, hiki ke hōʻoia i ka lawe ʻana i ka hōʻailona maikaʻi a me ka hoʻokele wela maikaʻi.
●Kaʻina hana:
Etching: I ka hana ʻana i nā papa alakaʻi, hoʻohana ʻia kahi hana etching. ʻO ka mua, ua uhi ʻia kahi papa photoresist ma luna o ka pā metala, a laila e ʻike ʻia i ka etchant e wehe i ka wahi i uhi ʻole ʻia e ka photoresist e hana i kahi kumu hoʻohālike alakaʻi maikaʻi.
Hoʻopalapala: Hoʻokomo ʻia kahi make holomua ma kahi paʻi kiʻekiʻe e hana i kahi kiʻi alakaʻi ma o ke kaʻina hoʻopaʻa ʻana.
●Pono hana:
Pono nā papa alakaʻi e loaʻa i ka conductivity uila kiʻekiʻe, ka conductivity thermal kiʻekiʻe, lawa ka ikaika a me ka paʻakikī, ke ʻano maikaʻi, ka hana kuʻi ʻana maikaʻi a me ke kūpaʻa ʻana i ka corrosion.
Hiki i nā ʻāpana keleawe ke hoʻokō i kēia mau koi hana. Hiki ke hoʻololi ʻia ko lākou ikaika, paʻakikī a me ka paʻakikī ma o ka alloying. I ka manawa like, ua maʻalahi lākou e hana i nā ʻōnaehana alakaʻi paʻakikī a pololei ma o ka stamping precision, electroplating, etching a me nā kaʻina hana ʻē aʻe.
● Hiki ke hoʻololi i ke kaiapuni:
Me nā koi o nā hoʻoponopono kaiapuni, hoʻokō nā ʻāpana keleawe i nā ʻano hana ʻōmaʻomaʻo e like me ke alakaʻi ʻole a me ka halogen-free, a maʻalahi ka hoʻokō ʻana i ka hana kūlohelohe.
I ka hōʻuluʻulu ʻana, ʻike nui ʻia ka hoʻohana ʻana o ke keleawe keleawe i nā papa alakaʻi i ke koho ʻana i nā mea kumu a me nā koi koʻikoʻi no ka hana ʻana i ke kaʻina hana, ʻoiai e noʻonoʻo ana i ka mālama ʻana i ke kaiapuni a me ka hoʻomau.
ʻO nā helu keleawe keleawe maʻamau a me kā lākou mau waiwai:
Papa Aluia | ʻO ka hui kemika % | Loaʻa ka mānoanoa mm | ||||
---|---|---|---|---|---|---|
GB | ASTM | JIS | Cu | Fe | P | |
TFe0.1 | C19210 | C1921 | hoomaha | 0.05-0.15 | 0.025-0.04 | 0.1-4.0 |
ʻO ka mānoanoa g/cm³ | Modulus o ka elasticity Gpa | Koefficient hoʻonui wela *10-6/℃ | Ka hoʻokuʻu uila %IACS | ʻAha wela W/(mK) | |||||
---|---|---|---|---|---|---|---|---|---|
8.94 | 125 | 16.9 | 85 | 350 |
Nā waiwai mīkini | Piʻo waiwai | |||||||
---|---|---|---|---|---|---|---|---|
Ka huhū | ʻoʻoleʻa HV | Ka hoʻokuʻu uila %IACS | Ho'āʻo hoʻopaʻapaʻa | 90°R/T(T<0.8mm) | 180°R/T(T<0.8mm) | |||
Ka ikaika tensile Mpa | ʻO ka elongation % | Ala maikaʻi | Ala ino | Ala maikaʻi | Ala ino | |||
O60 | ≤100 | ≥85 | 260-330 | ≥30 | 0.0 | 0.0 | 0.0 | 0.0 |
H01 | 90-115 | ≥85 | 300-360 | ≥20 | 0.0 | 0.0 | 1.5 | 1.5 |
H02 | 100-125 | ≥85 | 320-410 | ≥6 | 1.0 | 1.0 | 1.5 | 2.0 |
H03 | 110-130 | ≥85 | 360-440 | ≥5 | 1.5 | 1.5 | 2.0 | 2.0 |
H04 | 115-135 | ≥85 | 390-470 | ≥4 | 2.0 | 2.0 | 2.0 | 2.0 |
H06 | ≥130 | ≥85 | ≥430 | ≥2 | 2.5 | 2.5 | 2.5 | 3.0 |
H06S | ≥125 | ≥90 | ≥420 | ≥3 | 2.5 | 2.5 | 2.5 | 3.0 |
H08 | 130-155 | ≥85 | 440-510 | ≥1 | 3.0 | 4.0 | 3.0 | 4.0 |
H10 | ≥135 | ≥85 | ≥450 | ≥1 | —— | —— | —— | —— |
Ka manawa hoʻouna: Sep-21-2024